Reports coming out of Taiwan state that TSMC has begun production of the Snapdragon 875 - Qualcomm's next-generation flagship chipset. The company will announce it officially towards the end of the year and the new chip will likely power premium phones in early 2021. The S875 is being fabbed at a 5nm process node, which should enable power savings, higher clock speeds and more transistors. Unlike the S865, the new chip is expected to have an integrated modem, the 5G-enabled X60 (which will also be used by the new iPhone 12 models). The chipset will continue to use a 1+3+4 CPU...